|
Model Number/Core Frequency |
Phenom X4 840 @ 3.2 GHz |
|
OPN |
HDX840WFK42GM |
|
L1 Cache |
64 kB instruction/64 kB data per core (512 kB per CPU) |
|
L2 Cache |
512 kB per core (2 MB per CPU) |
|
Memory Controller |
Integrated 128 bit wide memory controller |
|
|
Up to 2.0 GHz with Dual Dynamic Power Management |
|
Supported Memory |
DDR2 up to PC2-8500 (1066 MHz) |
|
|
DDR3 up to PC3-10600 (1333 MHz) |
|
HyperTransport 3 Specification |
One 16/16-bit link at up to 4 GHz full duplex (2 GHz x 2) |
|
Total CPU-to-system bandwidth |
Up to 37.3 GB/s (21.3 GB/s memory, 16.0 GB/s HT3) with DDR3 |
|
|
Up to 33.1 GB/s (17.1 GB/s memory, 16.0 GB/s HT3) with DDR2 |
|
Packaging |
938-pin Socket AM3 organic micro-pin grid array (mPGA) |
|
Fab. Location |
GlobalFoundries Fab. 1 module 1 in Dresden, Germany |
|
Process Technology |
45 nm DSL SOI (Silicon On Insulator) |
|
Approximate Die Size |
169 mm-squared |
|
Approximate Transistor Count |
ca. 300 million |
|
Max. Thermal Design Power |
95 Watts |
|
Codename |
“Propus” |
2402 8130
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