Asrock Motherboard H61m S1155 2pci Ddr3 Dvi Hdmi Gigabit Placa Madre USD 94 IVA inc
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- REV 3.0 - New P67 B3 Revision Intel P67 Based Military-grade Motherboard with Thermal Armor
- Intel® LGA1155 socket for Intel® 2nd Generation Core™ i7/ Core™ i5/ Core™ i3 Processors
- Intel® P67 Express Chipset
- TUF Thermal Armor - Total Airflow-Boosting Heat Dissipation
- TUF Thermal Radar - Real Time Temp Detection and Heat Removal
- TUF Components [Alloy Choke, Cap. & MOSFET; Certified by Military-standard] - Certified for Tough Duty
- E.S.P. [Efficient Switching Power Design] - Optimal power efficiency for key components
Cpu | 2nd Generation Core™ i7/Core™ i5/Core™ i3 Processors Supports Intel® 32 nm CPU Supports Intel® Turbo Boost Technology 2.0 | Socket | Intel® Socket 1155 | Chipset | Intel® P67(B3) | Memoria | 4 x DIMM, Max. 32GB, DDR3 1866/1800/1600/1333/1066 Hz Non-ECC, Un-buffered Memory Dual Channel Memory Architecture Supports Intel® Extreme Memory Profile (XMP) | Almacenamiento | 2 x SATA 6Gb/s port(s), brown 1 x eSATA 3Gb/s port(s), black 2 x SATA 6Gb/s port(s), gray 1 x Power eSATA 3Gb/s port(s), green 1 x eSATA 3Gb/s port(s), red | Raid | 0, 1, 5, 10 | Audio | Realtek® ALC 892 8-Channel High Definition Audio CODEC | Lan | Intel® 82579, 1 x Gigabit LAN Controller(s) Intel® LAN- Dual interconnect between the Integrated LAN controller and Physical Layer (PHY) | Slots | 2 x PCIe 2.0 x16 (x16 or dual x8) 3 x PCIe 2.0 x1 1 x PCI Supports NVIDIA® Quad-GPU SLI™ Technology Supports AMD Quad-GPU CrossFireX™ Technology | Usb | 4 x USB 3.0 port(s) (2 at back panel, blue, 2 at mid-board) 14 x USB 2.0 port(s) (8 at back panel, , 6 at mid-board) | 1394 | VIA® 6308P controller 2 x IEEE 1394a port(s) (1 at mid-board, 1 at back panel) | Spdif | Optical S/PDIF out |
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